ARMONK, N.Y. and ALBANY, N.Y., April 24, 2017 /PRNewswire/ -- IBM (NYSE: IBM) and AIM Photonics, The American Institute for Manufacturing Integrated Photonics, an institute of Manufacturing USA,
today announced a patent and intellectual property licensing agreement
and confirmed IBM has joined the AIM Photonics consortium, which seeks
to advance integrated photonic circuit manufacturing and technology
collaboration between IBM and AIM Photonics is expected to provide a
path for the development of new technologies and products that will
further solidify the consortium's position in the integrated photonics
Additionally, the intellectual
property licensing agreement with IBM will help AIM Photonics establish
standard processes in the development of silicon photonics assemblies,
such as couplings for communication signals and light sources. Industry
and academic AIM Photonics members will access these technologies
through a process design kit (PDK) and prototype development at the
Rochester Test Assembly and Packaging (TAP) facility and the 300mm chip
facility at SUNY Poly's Albany campus.
"Adding IBM as a
member of AIM Photonics not only significantly strengthens this
outstanding institute, but highlights the momentum the Finger Lakes
region is experiencing in the high tech sector," said John Maggiore, New York State
photonics board of officers chairman. "This announcement further
validates the importance of this institute and the goals it has set out
membership, IBM will contribute to the development of AIM Photonics'
advanced integrated silicon photonics technology, packaging services,
and other future offerings to make advanced technology available to AIM
Photonics members and the wider technical community. IBM, together with
the other industry partners and the affiliated universities, will play a
significant role to direct advanced research activities of AIM
Photonics towards new products.
"Today's announcement furthers New York State's global leadership in developing next-generation integrated silicon photonics technologies," said Dr. Michael Liehr,
AIM Photonics CEO and SUNY Poly Executive Vice President of Innovation
and Technology and Vice President of Research. "Working side by side
with IBM photonic PIC and packaging experts is a significant milestone
for AIM Photonics as we continue to advance our capabilities and prepare
the TAP facility."
delivered a presentation at an AIM Photonics Technology summit during
The Optical Networking and Communication Conference & Exhibition
(OFC) in Los Angeles, California. Dr. Wilfried Haensch discussed "Advanced optical packaging for Integrated Silicon Photonics" to over 100 conference attendees.
AIM Photonics is
part of the overall Finger Lakes Forward revitalization effort—the
region's strategic plan for economic growth, which places an emphasis on
the industry cluster of optics, photonics and imaging to realize the
region's full potential and act as a core driver of jobs and output
growth. One of AIM Photonics' primary goals is to make Rochester
a technology hub for silicon photonics manufacturing and packaging,
generating both growth and job opportunities for the city of Rochester, Monroe County, and the State as a whole.
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produced six Nobel Laureates, a U.S. Presidential medal of Freedom, 10
U.S. National Medals of Technology, five U.S. National Medals of
Science, six Turing Awards, 19 inductees in the U.S. National Academy of
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