IBM and AIM Photonics Announce IP Licensing Agreement

8180 827 414

ARMONK, N.Y. and ALBANY, N.Y., April 24, 2017 /PRNewswire/ -- IBM (NYSE:   IBM) and AIM Photonics, The American Institute for Manufacturing Integrated Photonics, an institute of Manufacturing USA,

today announced a patent and intellectual property licensing agreement

and confirmed IBM has joined the AIM Photonics consortium, which seeks

to advance integrated photonic circuit manufacturing and technology





collaboration between IBM and AIM Photonics is expected to provide a

path for the development of new technologies and products that will

further solidify the consortium's position in the integrated photonics

manufacturing ecosystem.



Additionally, the intellectual

property licensing agreement with IBM will help AIM Photonics establish

standard processes in the development of silicon photonics assemblies,

such as couplings for communication signals and light sources. Industry

and academic AIM Photonics members will access these technologies

through a process design kit (PDK) and prototype development at the

Rochester Test Assembly and Packaging (TAP) facility and the 300mm chip

facility at SUNY Poly's Albany campus.


"Adding IBM as a

member of AIM Photonics not only significantly strengthens this

outstanding institute, but highlights the momentum the Finger Lakes

region is experiencing in the high tech sector," said John Maggiore, New York State

photonics board of officers chairman. "This announcement further

validates the importance of this institute and the goals it has set out

to achieve."


Through its

membership, IBM will contribute to the development of AIM Photonics'

advanced integrated silicon photonics technology, packaging services,

and other future offerings to make advanced technology available to AIM

Photonics members and the wider technical community. IBM, together with

the other industry partners and the affiliated universities, will play a

significant role to direct advanced research activities of AIM

Photonics towards new products.


"Today's announcement furthers New York State's global leadership in developing next-generation integrated silicon photonics technologies," said Dr. Michael Liehr,

AIM Photonics CEO and SUNY Poly Executive Vice President of Innovation

and Technology and Vice President of Research.  "Working side by side

with IBM photonic PIC and packaging experts is a significant milestone

for AIM Photonics as we continue to advance our capabilities and prepare

the TAP facility."


IBM recently

delivered a presentation at an AIM Photonics Technology summit during

The Optical Networking and Communication Conference & Exhibition

(OFC) in Los Angeles, California. Dr. Wilfried Haensch discussed "Advanced optical packaging for Integrated Silicon Photonics" to over 100 conference attendees.


AIM Photonics is

part of the overall Finger Lakes Forward revitalization effort—the

region's strategic plan for economic growth, which places an emphasis on

the industry cluster of optics, photonics and imaging to realize the

region's full potential and act as a core driver of jobs and output

growth. One of AIM Photonics' primary goals is to make Rochester

a technology hub for silicon photonics manufacturing and packaging,

generating both growth and job opportunities for the city of Rochester, Monroe County, and the State as a whole. 


Pictures are

available for use in publication, courtesy of SUNY Poly. To download,

please visit the following website and click on the icon in the upper

right hand corner; captions are provided under the "info" icon:


About IBM Research

more than seven decades, IBM Research has defined the future of

information technology with more than 3,000 researchers in 12 labs

located across six continents. Scientists from IBM Research have

produced six Nobel Laureates, a U.S. Presidential medal of Freedom, 10

U.S. National Medals of Technology, five U.S. National Medals of

Science, six Turing Awards, 19 inductees in the U.S. National Academy of

Sciences and 20 inductees into the U.S. National Inventors Hall of

Fame. For more information about IBM Research, visit

Info Source:

Online Application close


  • title:

  • Leave a message:

You can also contact us by